【MARBS】Nano-level bonding
Introducing next-generation bonding technology that chemically bonds different materials without using adhesives!
"Nano-level bonding" is a key technology for chemically bonding dissimilar materials. The next-generation plating and three-dimensional wiring technology "MARBS," which combines this technology that is gaining significant attention domestically with innovative plating techniques, achieves substrate-free solutions. Furthermore, plating is possible on materials that cannot be plated using sputtering or vapor deposition methods. 【Features of MARBS】 ■ Next-generation plating and three-dimensional wiring technology ■ Achieves substrate-free solutions ■ Plating is possible on materials that cannot be plated using sputtering or vapor deposition methods *For more details, please refer to the related link page or feel free to contact us.
- Company：豊光社
- Price：Other
